Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
- 23 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- A finite element calculation of stress intensity factors by a modified crack closure integralPublished by Elsevier ,2003
- Improvement of moisture resistance in plastic encapsulated MOS-IC by surface finishing copper leadframePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Analysis of package cracking during reflow soldering processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Moisture diffusion and heat transfer in plastic IC packagesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1996
- Investigation of crack propagation in ceramic/conductive epoxy/glass systemsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- A criterion for predicting delamination in plastic IC packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- A New Method for Measuring Adhesion Strength of IC Molding CompoundsJournal of Electronic Packaging, 1992
- Interface crack between two elastic layersInternational Journal of Fracture, 1990
- Efficient boundary element analysis of stress intensity factors for interface cracks in dissimilar materialsEngineering Fracture Mechanics, 1989
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985