Effect of N/Ge co-implantation on the Ge activation in GaN
- 3 September 2001
- journal article
- conference paper
- Published by AIP Publishing in Applied Physics Letters
- Vol. 79 (10) , 1468-1470
- https://doi.org/10.1063/1.1400089
Abstract
N-type regions have been produced in undoped GaN films by Ge and N/Ge implantation, sequentially, and subsequent annealing with a encapsulation layer at 1300 °C. Improved Ge-doping characteristics have been achieved for GaN by N/Ge co-implantation, attaining activation efficiencies above 95%, whereas in the case of conventional Ge implantation, the activation efficiency is low owing to the generation of N vacancies. In particular, overlapping of the N-implanted region with the Ge one can make the Ge activation higher at a N/Ge ratio of ∼1. Therefore, the co-implantation of additional N atoms drastically enhances the Ge activation based on a site-competition effect.
Keywords
This publication has 15 references indexed in Scilit:
- Lateral AlxGa1−xN power rectifiers with 9.7 kV reverse breakdown voltageApplied Physics Letters, 2001
- Temperature dependence and current transport mechanisms in AlxGa1−xN Schottky rectifiersApplied Physics Letters, 2000
- Electrical and structural analysis of high-dose Si implantation in GaNApplied Physics Letters, 1997
- Ion-implanted GaN junction field effect transistorApplied Physics Letters, 1996
- Ion implantation doping and isolation of GaNApplied Physics Letters, 1995
- Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologiesJournal of Applied Physics, 1994
- Microwave performance of GaN MESFETsElectronics Letters, 1994
- Wide bandgap compound semiconductors for superior high-voltage unipolar power devicesIEEE Transactions on Electron Devices, 1994
- High electron mobility transistor based on a GaN-AlxGa1−xN heterojunctionApplied Physics Letters, 1993
- Metal semiconductor field effect transistor based on single crystal GaNApplied Physics Letters, 1993