A dielectric surface coating technique to enhance boiling heat transfer from high power microelectronics
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (3) , 656-663
- https://doi.org/10.1109/95.465166
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- A Painting Technique to Enhance Pool Boiling Heat Transfer in Saturated FC-72Journal of Heat Transfer, 1995
- Thermal Management of Electronic Components with Dielectric Liquids.JSME International Journal Series B, 1993
- A technique for enhancing boiling heat transfer with application to cooling of electronic equipmentIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon LiquidJournal of Heat Transfer, 1989
- Fluid Selection and Property Effects in Single-and Two-Phase Immersion CoolingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- wall Superheat Excursions in the Boiling incipience of Dielectric FluidsHeat Transfer Engineering, 1988
- Boiling heat transfer from surfaces with porous layersInternational Journal of Heat and Mass Transfer, 1985
- Pool Boiling Heat Transfer From Enhanced Surfaces to Dielectric FluidsJournal of Heat Transfer, 1982
- Hydrodynamic Prediction of Peak Pool-boiling Heat Fluxes from Finite BodiesJournal of Heat Transfer, 1973
- On the Nature and Location of Bubble Nuclei in Boiling from SurfacesJournal of Applied Physics, 1958