Structural integrity and thermal stability of TiN/CoSi2 used as local interconnect in a self-aligned CoSi2 process
- 1 October 1991
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 52 (1) , 59-69
- https://doi.org/10.1016/0169-4332(91)90115-z
Abstract
No abstract availableKeywords
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