Electromigration Induced Failure as a Function of Via Interface

Publisher Website

1 January 1997

journal article
Published by Springer Nature in MRS Proceedings

Vol. 473
https://doi.org/10.1557/proc-473-401

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

Effect of Via Etch Profile and Barrier Metal on Electromigration Performance of W-Filled Via Structure in TiN/AlCu/TiN Metallization
MRS Proceedings, 1995
Evidence of The Electromigration Short-Length Effect in Aluminum-Based Metallurgy With Tungsten Diffusion Barriers
MRS Proceedings, 1993
Stress and Electromigration in Thin Film Metallisation
MRS Proceedings, 1991
Electromigration in thin gold films on molybdenum surfaces
Thin Solid Films, 1975