Stress and Electromigration in Thin Film Metallisation
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 34 references indexed in Scilit:
- Stress-driven diffusive voiding of aluminum conductor linesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Electromigration and mechanical stress in aluminium conductor tracks passivated by anodisationJournal of Electronic Materials, 1990
- Stress distribution in an aluminum interconnect of very large scale integrationJournal of Applied Physics, 1990
- The effect of anodization on the electromigration drift velocity in aluminum filmsJournal of Applied Physics, 1989
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Stress relaxation and hillock growth in thin filmsActa Metallurgica, 1982
- Thermal strain in lead thin films I: Dependence of the strain on crystal orientationThin Solid Films, 1977
- The threshold current density and incubation time to electromigration in gold filmsThin Solid Films, 1977
- Hillock growth in thin filmsJournal of Applied Physics, 1974
- Stress Relief and Hillock Formation in Thin Lead FilmsJournal of Applied Physics, 1970