Thermosonic Gold Wire Bonding to Copper Conductors

This publication has 4 references indexed in Scilit:

• Degradation of Thermocompression Bonds to Ti-Cu-Au and Ti-Cu Thin Films by Thermal Aging
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
• The failure of aged CuAu thin films by Kirkendall porosity
  Thin Solid Films, 1979
• On the formation of the ordered phases CuAu and Cu3Au at a copper/gold planar interface
  Metallurgical Transactions A, 1979
• Reduced Gold-Plating on Copper Leads for Thermocompression Bonding-Part I: Initial Characterization
  IEEE Transactions on Parts, Hybrids, and Packaging, 1977