Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects
- 1 January 1993
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Direct chip interconnect with adhesive conductor filmsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Investigations into the use of Adhesives For Level-1 Microelectronic InterconnectionsMRS Proceedings, 1989