Role of the Interface in the Adhesion of Cu to SiO2
- 1 January 1989
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Residual Stress, Fracture, and Adhesion in Sputter-Deposited Molybdenum FilmsMRS Proceedings, 1988
- Adhesion of Reactive Ion Implanted Copper Films on Al2O3 and SiO2MRS Proceedings, 1987
- Ion Beam Enhanced Adhesion of Thin FilmsMRS Proceedings, 1983
- Technology of ion beam sources used in sputteringJournal of Vacuum Science and Technology, 1978
- Optical Properties of Reactively Evaporated Chromium Oxide FilmsJournal of Vacuum Science and Technology, 1967
- Measurement of Metallic Film Densities by an Optical TechniqueJournal of Applied Physics, 1965