In situ scanning-tunneling-microscopy studies of current driven mass transport in Ag
- 1 November 1993
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 74 (9) , 5476-5482
- https://doi.org/10.1063/1.354228
Abstract
We present the results of an ultrahigh vacuum (UHV) scanning‐tunneling‐microscopy study of large scale mass transport in current carrying metal films. Scans were taken in situ on a current carrying 2100‐Å‐thick Ag film with current densities ranging from 5.0×104 A/cm2 up to 3.2×105 A/cm2, at which point the sample failed due to a runaway thermal fusing mechanism. Axial UHV inchworms allowed us to obtain data from the same 2‐μm‐square region of the sample throughout the experiment in spite of large temperature‐induced drifts. Calculations of the driving forces demonstrate that the electromigration driving force was dominant for this current range. Significant topographical changes were observed including current aligned grain growth, current induced faceting, and complex mass flow divergences. A model that explains the observed divergences is presented. It is based upon diffusion in the presence of local inhomogeneities of the electric field.This publication has 8 references indexed in Scilit:
- Scanning probe microscopy studies of electromigration in electroplated Au wiresJournal of Applied Physics, 1993
- Ultrahigh vacuum scanning-tunneling microscope for in situ studies of annealing and electromigration behavior of thin filmsJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1993
- Electromigration in thin-film interconnection lines: models, methods and resultsMaterials Science Reports, 1991
- Electromigration in metalsReports on Progress in Physics, 1989
- Activation energy for electrotransport in thin silver and gold filmsThin Solid Films, 1975
- Effect of driving forces on atom motionThin Solid Films, 1975
- Electrotransport on Surfaces and InterfacesZeitschrift für Naturforschung A, 1971
- The influence of surface energy on thermal etchingActa Metallurgica, 1958