A novel structure to realize crack-free plastic package during reflow soldering process-development of CSS (chip side support) package
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 310-317
- https://doi.org/10.1109/iemt.1995.526180
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Package Deformation And Cracking Mechanism Due To Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Analysis of package cracking during reflow soldering processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Analytical and experimental study for designing molding compounds for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Simplified and practical estimation of package cracking during reflow soldering processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1994
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985