Elastic stiffness and thermal expansion coefficient of boron nitride films
- 15 March 1985
- journal article
- conference paper
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 57 (6) , 2340-2342
- https://doi.org/10.1063/1.334341
Abstract
The temperature‐dependent stress of boron‐nitride (BN) films deposited by low‐pressure chemical vapor deposition was measured using an optically leveraged laser apparatus. The measurements were used to calculate values of E/1−ν and α for BN as a function of the NH3/B2H6 ratio. Values of E/1‐ν≂1×1012 dynes/cm2 and α≂5×10−6 °K−1 were obtained independent of the NH3/B2H6 ratio. The intrinsic‐stress and the thermal‐stress contributions to the room‐temperature stress were estimated for different substrates and the values were used to rationalize the strong dependence of the room temperature stress on chemical vapor deposition processing variables.This publication has 8 references indexed in Scilit:
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