Local laser bonding for low temperature budget
- 1 April 2002
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 97-98, 422-427
- https://doi.org/10.1016/s0924-4247(01)00871-8
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Assembling three-dimensional microstructures using gold-silicon eutectic bondingSensors and Actuators A: Physical, 1994
- Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperatureSensors and Actuators A: Physical, 1994