Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
- 1 July 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (7) , 866-870
- https://doi.org/10.1007/s11664-998-0111-6
Abstract
No abstract availableKeywords
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