An advanced millimeter-wave flip-chip IC integrating different kinds of active devices
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 3, 1619-1622
- https://doi.org/10.1109/mwsym.1996.512248
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A novel millimeter-wave IC on Si substrate using flip-chip bonding technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A new LSI bonding technology 'Micron bump bonding assembly technology'Published by Institute of Electrical and Electronics Engineers (IEEE) ,1988