Development of novel low temperature bonding technologies for microchip chemical analysis applications
- 1 August 2000
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 84 (1-2) , 103-108
- https://doi.org/10.1016/s0924-4247(99)00346-5
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Water glass bondingSensors and Actuators A: Physical, 1999
- Wafer-to-wafer bonding for microstructure formationProceedings of the IEEE, 1998
- Systematic Low Temperature Silicon Bonding using Pressure and TemperatureJapanese Journal of Applied Physics, 1998
- Bonding wafers with sodium silicate solutionJournal of Micromechanics and Microengineering, 1997
- Fused Quartz Substrates for Microchip ElectrophoresisAnalytical Chemistry, 1995
- Vacuum packaging for microsensors by glass-silicon anodic bondingSensors and Actuators A: Physical, 1994
- Micromachining of capillary electrophoresis injectors and separators on glass chips and evaluation of flow at capillary intersectionsAnalytical Chemistry, 1994
- Micromachining a Miniaturized Capillary Electrophoresis-Based Chemical Analysis System on a ChipScience, 1993
- Silicon‐On‐Insulator by Wafer Bonding: A ReviewJournal of the Electrochemical Society, 1991
- Miniaturized total chemical analysis systems: A novel concept for chemical sensingSensors and Actuators B: Chemical, 1990