Wafer-to-wafer bonding for microstructure formation
- 1 August 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 86 (8) , 1575-1585
- https://doi.org/10.1109/5.704262
Abstract
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods are discussed. Opportunities for continued development are outlined.Keywords
This publication has 43 references indexed in Scilit:
- Surface micromachined structures fabricated with silicon fusion bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Batch transfer of microstructures using flip-chip solder bump bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A merged MEMS-CMOS process using silicon wafer bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Bond-quality characterization of silicon-glass anodic bondingSensors and Actuators A: Physical, 1997
- Silicon fusion bonding and deep reactive ion etching: a new technology for microstructuresSensors and Actuators A: Physical, 1996
- Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperatureSensors and Actuators A: Physical, 1994
- Design of sealed cavity microstructures formed by silicon wafer bondingJournal of Microelectromechanical Systems, 1993
- A novel structure of pressure sensorsIEEE Transactions on Electron Devices, 1991
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- An ultraminiature solid-state pressure sensor for a cardiovascular catheterIEEE Transactions on Electron Devices, 1988