Silver metallization for advanced interconnects

This publication has 3 references indexed in Scilit:

• Stresses in thin film metallization
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
• Stress-Induced Void Formation in Metal Lines
  MRS Bulletin, 1993
• Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIs
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1993