Stresses in thin film metallization
- 1 June 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (2) , 241-250
- https://doi.org/10.1109/95.588580
Abstract
No abstract availableThis publication has 15 references indexed in Scilit:
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