Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven
- 1 January 1988
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 1 (3) , 105-114
- https://doi.org/10.1109/66.4383
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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