Growth kinetics and step coverage in plasma deposition of silicon dioxide from organosilicon compounds
- 1 July 1991
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 139, 376-379
- https://doi.org/10.1016/0921-5093(91)90645-4
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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- Plasma-enhanced chemical vapour deposition of silicon dioxide using tetraethoxysilane as silicon sourceThin Solid Films, 1989
- Low-temperature deposition of silicon dioxide films from electron cyclotron resonant microwave plasmasJournal of Applied Physics, 1989