A new approach to using anisotropically conductive adhesives for flip chip assembly
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Development goals and present status of 3M's adhesive interconnection technologyJournal of Electronics Manufacturing, 1993
- Investigations into the use of Adhesives For Level-1 Microelectronic InterconnectionsMRS Proceedings, 1989