Si dangling-bond-type defects at the interface of (100)Si with ultrathin HfO2
- 9 June 2003
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 82 (23) , 4074-4076
- https://doi.org/10.1063/1.1579564
Abstract
Electron spin resonance analysis of (100)Si/HfO2 interfaces prepared by chemical vapor deposition of the oxide using three chemically different precursors reveals that the trivalent Si defects common for Si/SiO2 interfaces—Pb0 and Pb1 centers—are universally observed upon hydrogen detachment. The density of the Pb0 is higher than in the (100)Si/SiO2 structures and is sensitive to the deposition process. However, the density can be significantly reduced by annealing of the Si/HfO2 structures in O-containing ambient, likely through re-establishing the Si/SiO2 interface. Also, the Pb-type centers can be entirely passivated by hydrogen already at 400 °C. The density of fast interface states closely follows the variations in the Pb0 center density, suggesting it as the dominant contribution to the fast interface states.Keywords
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