Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip
- 1 December 1997
- journal article
- e conceptual-paper
- Published by Emerald Publishing in Circuit World
- Vol. 23 (4) , 22-25
- https://doi.org/10.1108/03056129710370277
Abstract
The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.Keywords
This publication has 12 references indexed in Scilit:
- Reliability characterization of the SLICC packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- New type LOC adhesive tapesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Memory package with LOC structure using new adhesive materialPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Chip scale package (CSP) "a lightly dressed LSI chip"Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The resin molded chip size package (MCSP)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Simple-structure, generally applicable chip-scale packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Ceramic mini-ball grid array package for high speed devicePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Handbook of Fine Pitch Surface Mount TechnologyPublished by Springer Nature ,1994
- Thermal Stress and Strain in Microelectronics PackagingPublished by Springer Nature ,1993
- Solder Joint ReliabilityPublished by Springer Nature ,1991