Diffusion Barrier Effect of Ultra-Thin Photo-Nitrided a-Si:H Overlayer on SnO2/Glass Substrate

Abstract
Metallic tin diffusion into p-type hydrogenated amorphous silicon (a-Si:H) deposited on a flat or textured SnO2/glass substrate has been dramatically reduced by introducing a photo-nitrided a-Si:H (5-Å-thick) diffusion barrier between photochemical vapor deposition (photo-CVD) a-Si:H and SnO2, and the diffusion depth is about 30 Å from the a-Si:H/SnO2 interface. It is also shown that the optical transmittance is significantly improved by employing a 5-Å-thick photo-nitrided barrier layer.

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