Acoustic waveguide monitoring of the cure and structural integrity of composite materials
- 1 March 1986
- journal article
- Published by Wiley in Polymer Engineering & Science
- Vol. 26 (5) , 367-372
- https://doi.org/10.1002/pen.760260508
Abstract
No abstract availableKeywords
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- The Use of Dielectric Analysis to Study the Cure of a Filled Epoxy ResinIEEE Transactions on Electrical Insulation, 1981
- MicrodielectrometrySensors and Actuators, 1981
- A new tool for determination of the stage of polymerization of thermosetting polymersJournal of Polymer Science, 1952