Analysis of a thermally enhanced ball grid array package
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Analysis of thermal vias in high density interconnect technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Methodology for the thermal characterization of the MQUAD microelectronic packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Modelling of thermal vias in thin film multichip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002