Extendibility of Cu Damascene to 0.1 μm Wide Interconnections
- 1 January 1998
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Copper interconnections and reliabilityMaterials Chemistry and Physics, 1998
- Directional and preferential sputtering-based physical vapor depositionThin Solid Films, 1995
- Four Point Sheet Resistivity TechniquesReview of Scientific Instruments, 1966