Novel refractory contact and interconnect metallizations for high-voltage and smart-power applications
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 37 (10) , 2207-2221
- https://doi.org/10.1109/16.59911
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
- Effect of gate resistance on high-frequency power switching efficiencies of advanced power MOSFETsIEEE Journal of Solid-State Circuits, 1990
- Self-aligned cobalt disilicide for gate and interconnection and contacts to shallow junctionsIEEE Transactions on Electron Devices, 1987
- A new integrated silicon gate technology combining bipolar linear, CMOS logic, and DMOS power partsIEEE Transactions on Electron Devices, 1986
- Lateral HVIC with 1200-V bipolar and field-effect devicesIEEE Transactions on Electron Devices, 1986
- The operation of power MOSFET in reverse modeIEEE Transactions on Electron Devices, 1983
- Power semiconductor switching devices—A comparison based on inductive switchingIEEE Transactions on Electron Devices, 1982
- Effect of scaling of interconnections on the time delay of VLSI circuitsIEEE Transactions on Electron Devices, 1982
- Speed limitations due to interconnect time constants in VLSI integrated circuitsIEEE Electron Device Letters, 1982
- Electromigration-Induced Failures in VLSI InterconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1982
- Nonplanar power field-effect transistorsIEEE Transactions on Electron Devices, 1978