Electroplasticity and Electromigration
- 1 January 1994
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Electromigration-induced dislocation climb and multiplication in conducting linesActa Metallurgica et Materialia, 1994
- Electromigration failure by shape change of voids in bamboo linesJournal of Applied Physics, 1994
- Mechanical strength and microstructure of oxygen ion-implanted Al filmsJournal of Materials Research, 1994
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- Morphology of electromigration-induced damage and failure in Al alloy thin film conductorsJournal of Electronic Materials, 1990
- Overview no. 49Acta Metallurgica, 1986
- A reply to comments on the electroplastic effect in aluminumScripta Metallurgica, 1980