Electromigration failure by shape change of voids in bamboo lines
- 1 August 1994
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 76 (3) , 1563-1571
- https://doi.org/10.1063/1.357734
Abstract
The behavior of electromigration‐induced voids in narrow, unpassivated aluminum interconnects is examined, using scanning electron microscopy. Some electromigration tests were interrupted several times in order to observe void nucleation, void growth, and finally the failure of the conductor line. It is found that voids which opened the line have a specific asymmetric shape with respect to the electron flow direction. Besides void nucleation and void growth, void shape changes can consume a major part of the lifetime of the conductor line. A first attempt to model these processes on the basis of diffusion along the void surface shows that voids with a noncircular initial shape tend to produce the fatal asymmetry due to electron wind effects, with the anisotropy of surface energy possibly playing only a minor role.This publication has 23 references indexed in Scilit:
- Observation and Modelling of Electromigration-Induced Void growth in Al-Based InterconnectsMRS Proceedings, 1993
- The Microstructural Nature of Electromigration and Mechanical Stress Voids in Integratedcircuit InterconnectMRS Proceedings, 1993
- Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnectsApplied Physics Letters, 1992
- High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration StressMRS Proceedings, 1992
- Microstructural Aspects of Interconnect FailureMRS Proceedings, 1992
- The effect of stress-induced voiding on electromigrationJournal of Applied Physics, 1992
- A model for the effect of line width and mechanical strength on electromigration failure of interconnects with “near-bamboo” grain structuresJournal of Materials Research, 1991
- Electromigration in a single crystalline submicron width aluminum interconnectionApplied Physics Letters, 1991
- Electromigration Damage by Current Induced Coalescence of Thermal Stress VoidsMRS Proceedings, 1991
- TEM in-situ observation of electromigration in A1 stripes with quasi-bamboo structurePhysica Status Solidi (a), 1981