SWEAT structure design and test procedure criteria based upon TEARS characterization and spatial distribution of failures in iterated structures
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Simulation and testing of temperature distribution and resistance versus power for SWEAT and related Joule-heated metal-on-insulator structuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal analysis of electromigration test structuresIEEE Transactions on Electron Devices, 1987
- Wafer Level Electromigration Tests for Production Monitoring8th Reliability Physics Symposium, 1985
- Static temperature distribution in IC chips with isothermal heat sourcesIEEE Transactions on Electron Devices, 1974
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969