Moisture sensitivity characterization of plastic surface mount devices using scanning acoustic microscopy
- 1 January 1992
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
An attempt was made to characterize the moisture ingress kinetics of six known vendor-supplied moisture-sensitive IC surface mount devices. Induced damage response by exposure to IR reflow was then characterized using C-mode scanning acoustic microscopy. Damage analysis indicated that moisture ingress sensitivity can vary significantly from device to device with little correlation to total pin count. Accelerated performance testing using temperature cycling revealed that this test is only second order effective in accelerating the failure of moisture-damaged devices. Correlation between ambient aging and accelerated testing was possible using both an established failure criteria assessment and moisture diffusion calculations. Safe ambient exposure times from out-of-the-dry-bag to board assembly for these devices were determined using this methodology.Keywords
This publication has 6 references indexed in Scilit:
- Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A new bond failure wire crater in surface mount devicePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Analysis of package cracking during reflow soldering processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Correlation of surface mount plastic package reliability testing to nondestructive inspection by scanning acoustic microscopyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Investigations of Large PLCC Package Cracking During Surface Mount ExposureIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985