Planarized thin film inductors and capacitors for hybrid integrated circuits made of aluminum and anodic alumina
- 1 May 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 17 (2) , 197-200
- https://doi.org/10.1109/96.330429
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Thin film interconnect processesThin Solid Films, 1991
- Primary investigation of anodized aluminium as a substrate for hybrid microelectronicsInternational Journal of Electronics, 1990
- An Anodic Process for Forming Planar Interconnection Metallization for Multilevel LSIJournal of the Electrochemical Society, 1975