Platinum Metal Plating—A Process and Applicational Survey
- 1 January 1970
- journal article
- research article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 48 (1) , 115-123
- https://doi.org/10.1080/00202967.1970.11870140
Abstract
Processes for the electrodeposition of the platinum group metals are reviewed, from the viewpoint of general electrolyte and deposit characteristics rather than that of detailed plating procedures. Applications are briefly discussed, with special reference to the electronics field. On grounds of limited availability, the platinum metals can offer no serious challenge to the pre-eminence of gold but they offer advantages in respect of wear resistance, elevated temperature stability, and erosion resistance.Keywords
This publication has 15 references indexed in Scilit:
- Electrodeposition of RutheniumTransactions of the IMF, 1969
- Electrodeposition of Ductile PalladiumTransactions of the IMF, 1968
- Physical Properties of Palladium ElectrodepositsTransactions of the IMF, 1966
- Electrodeposition of Rhodium and Ruthenium for Slip-ring SurfacesTransactions of the IMF, 1965
- The Electrodeposition of IridiumJournal of the Electrochemical Society, 1962
- Electrodeposition of RutheniumTransactions of the IMF, 1961
- Electrodeposition of Platinum from Chloroplatinic AcidTransactions of the IMF, 1959
- Some Experimental Observations on the Effect of Addition Agents on Stress and Cracking in Rhodium DepositsTransactions of the IMF, 1959
- Organic Deposits on Precious Metal ContactsBell System Technical Journal, 1958
- Electrodeposition of Platinum, Palladium and RhodiumTransactions of The Electrochemical Society, 1931