Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips
- 1 January 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (3) , 523-528
- https://doi.org/10.1109/33.83938
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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