Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (3) , 406-409
- https://doi.org/10.1109/33.35490
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopyJournal of Electronic Materials, 1989
- Successful alloy attachment of GaAs MMIC'sIEEE Transactions on Electron Devices, 1987
- Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Acoustic microscope—scanning versionApplied Physics Letters, 1974