Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy
- 1 March 1989
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 18 (2) , 327-337
- https://doi.org/10.1007/bf02657425
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Die bond materials and bonding mechanisms in microelectronic packagingThin Solid Films, 1987
- Use of Wetting Angle Measurements in Reliability Evaluations of Au-Si Eutectic Die Attach8th Reliability Physics Symposium, 1985
- AES/ESCA/SEM/EDX Studies of Die Bond Materials and Interfaces8th Reliability Physics Symposium, 1984
- Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Electromigration, Thermal Analysis and Die Attach--A Case History8th Reliability Physics Symposium, 1982
- Some Considerations of the Gold-Silicon Die Bond Based on Surface Chemical Analysis8th Reliability Physics Symposium, 1980
- Physics of Die Attach InterfacesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1980
- Properties of Die Bond Alloys Relating to Thermal FatigueIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
- Surface Segregation of Non-Bonding Impurities in Gold-Silicon Preforms8th Reliability Physics Symposium, 1977
- Acoustic microscope—scanning versionApplied Physics Letters, 1974