Chip integration of Sea of Leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics
- 28 September 2004
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1167-1173
- https://doi.org/10.1109/ectc.2004.1319489
Abstract
No abstract availableKeywords
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