A 3D integration scheme utilizing wireless interconnections for implementing hyper brains
- 30 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 262-597 Vol. 1
- https://doi.org/10.1109/isscc.2005.1493969
Abstract
A 3D integration custom stack system utilizing a local wireless interconnect (LWI) and a global wireless interconnect (GWI) is proposed. The LWI transfers Gb/s pulses using resonant coupling of spiral inductors with low-power dissipation of several mW. The GWI transfers global clocks and data on a 20 GHz signal using on-chip antennas.Keywords
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