Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
- 1 January 2002
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 43 (8) , 1784-1790
- https://doi.org/10.2320/matertrans.43.1784
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Practical application of fine pitch component mounting with precoat solderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance TestMATERIALS TRANSACTIONS, 2001
- Electrochemical migration tests of solder alloys in pure waterCorrosion Science, 1997
- Lead-free Solder and Micro-joining.Materia Japan, 1996
- Investigation of multi-component lead-free soldersJournal of Electronic Materials, 1994
- New lead-free, Sn-Zn-In solder alloysJournal of Electronic Materials, 1994
- Parameterization of the solution data for binary alloys by hultgren et al.Calphad, 1991
- Metallic electromigration phenomenaIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermodynamics of Wetting by Liquid MetalsMRS Proceedings, 1987