Influence of the electron mean free path on the resistivity of thin metal films

This publication has 12 references indexed in Scilit:

• Thickness dependence of resistivity for Cu films deposited by ion beam deposition
  Applied Surface Science, 2003
• Increase in Electrical Resistivity of Copper and Aluminum Fine Lines
  MATERIALS TRANSACTIONS, 2002
• Electron inelastic mean free paths (IMFPs) in binary Au-Cu alloys determined by elastic peak electron spectroscopy
  Surface and Interface Analysis, 2001
• Interconnect limits on gigascale integration (GSI) in the 21st century
  Proceedings of the IEEE, 2001
• Formation of aluminum oxynitride diffusion barriers for Ag metallization
  Applied Physics Letters, 1999
• Large deviation from Matthiessen's rule in chemical vapour deposited copper films and its correlation with nanostructure
  Journal of Physics D: Applied Physics, 1997
• ELECTRICAL RESISTIVITY MODEL FOR POLYCRYSTALLINE FILMS: THE CASE OF SPECULAR REFLECTION AT EXTERNAL SURFACES
  Applied Physics Letters, 1969
• The mean free path of electrons in metals
  Advances in Physics, 1952
• The conductivity of thin metallic films according to the electron theory of metals
  Mathematical Proceedings of the Cambridge Philosophical Society, 1938
• Röntgenographische und elektrische Untersuchungen des CuAu‐Systems
  Annalen der Physik, 1936