Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
- 1 October 1995
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 91 (1-4) , 382-387
- https://doi.org/10.1016/0169-4332(95)00151-4
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Prediction of Step Coverage during Blanket CVD Tungsten Deposition in Cylindrical PoresJournal of the Electrochemical Society, 1990