A 3.5 W HBT MMIC power amplifier module for mobile communications

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  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
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  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
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  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Bump heat sink technology - A novel assembly technology suitable for power HBTs
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
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  IEEE Electron Device Letters, 1991
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