Failure mechanism models for material aging due to interdiffusion
- 1 March 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Reliability
- Vol. 43 (1) , 2-10
- https://doi.org/10.1109/24.285101
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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