A compact V-band 3DMMIC single-chip down-converter using photosensitive BCB dielectric film
- 20 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 131-134
- https://doi.org/10.1109/mwsym.1999.779441
Abstract
A high-density MMIC V-band down-converter that employs the masterslice 3DMMIC technology and photosensitive BCB dielectric film, is presented. The down-converter is structured using an 8/spl times/2 master array in a 1.84 mm/spl times/0.87 mm chip. A down-converter MMIC with H-MESFET with f/sub max/ of 130 GHz demonstrates the gain of 19.3 dB and image rejection ratio of above 18 dB over the frequency range of 56.5 GHz to 59.5 GHz; its associated gain-density is five times higher than that of conventional MMICs.Keywords
This publication has 5 references indexed in Scilit:
- 60 GHz GaAs MMIC technology for a high data rate mobile broadband demonstratorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Millimeter-wave three-dimensional masterslice MMICSPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Three-Dimensional MMIC Interconnect Process using Photosensitive BCB and STO CapacitorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1998
- Sixty-GHz-band ultra-miniature monolithic T/R modules for multimedia wireless communication systemsIEEE Transactions on Microwave Theory and Techniques, 1996
- Three-dimensional passive circuit technology for ultra-compact MMICsIEEE Transactions on Microwave Theory and Techniques, 1995