Radiation hardened metal-oxide-semiconductor devices with gate dielectrics grown by rapid thermal processing in O2 with diluted NF3

Abstract
Radiation‐hardened, fluorinated gate oxides have been obtained by rapid thermal processing of silicon in O2 with diluted NF3. Diluted NF3 is used as a source of fluorine and is introduced during the initial stage of rapid thermal processing. It is found that optimum amounts of fluorine incorporated at the Si/SiO2 interface improve resistance against x‐ray radiation; however, excessive amounts of fluorine degrade the radiation hardness.