Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief
- 1 December 1993
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 3 (4) , 243-246
- https://doi.org/10.1088/0960-1317/3/4/020
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Realization of mechanical decoupling zones for package-stress reductionSensors and Actuators A: Physical, 1993
- Mechanical property measurements of thin films using load-deflection of composite rectangular membranesSensors and Actuators, 1989
- Microsensor packaging and system partitioningSensors and Actuators, 1988