Impact of substrate finish on Sn/Ag/Cu alloy solder joint
- 21 March 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- An intermetallic study of solder joints with Sn-Ag-Cu lead-free solderPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu PadsMATERIALS TRANSACTIONS, 2001
- Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic SolderMATERIALS TRANSACTIONS, 2001