Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
- 1 January 2001
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 42 (5) , 756-760
- https://doi.org/10.2320/matertrans.42.756
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after agingMetallurgical and Materials Transactions A, 2000
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- Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich soldersJournal of Electronic Materials, 1996
- Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low TemperatureDefect and Diffusion Forum, 1991